Advanced Packaging

 

Reliable Performance in the Harshest Environments

Curtiss-Wright distinguishes itself from other electronic packaging suppliers by specializing in engineered packaging solutions, primarily for rugged government, military, and aerospace applications. Our solutions are designed using a modular open systems approach to be aligned with CMOSS, SOSA, GVA, and other essential technology standards for interoperability and sustained technology relevance.

Using thermal, structural, and signal integrity engineering expertise delivers predictable, reliable performance for all aerospace and defense missions, from small-form factor to high-performance embedded computing modules, chassis, and systems. Curtiss-Wright processing technologies are designed with MIL-STD qualification in mind and scale across VPX (VITA 46), VPX REDI (VITA 48), OpenVPX (VITA 65/68), VME64x, and small form factor architectures. The technology building blocks developed are ideally suited to developing purpose-built solutions quickly, with significantly reduced program risk.

Reliable Performance Through Better Cooling Technologies

Expelled heat from processors functioning at full performance cause reliability and determinism problems for mission-critical applications. When computer components get too hot, they do not perform to their designed specifications, become unreliable, and deliver variable processing performance. Curtiss-Wright has developed the most efficient and effective natural and forced air, liquid, and hybrid cooling technologies to keep these systems running reliably and performing as designed.

Our proven conduction cooling technology (ANSI/VITA 48.2) delivers reliability in a highly rugged package. Air-cooled technologies are optimized to manage air streams enabling payloads cards and their associated mezzanine cards to remain cool. To cool payloads with higher power requirements associated with the latest generation of data center CPU, FPGA, and GPU processors, Air-Flow-Through (AFT – ANSI/VITA 48.8) technology is relied upon. When processing density is at its highest, Liquid-Flow-Through (LFT – ANSI/VITA 48.4) and fluid-flow-through (FFT) technologies are trusted to remove more waste heat than any other approach.

Curtiss-Wright engineers cooling technologies to ensure reliable, deterministic processing performance, incorporating ease of maintenance and protection against EMI, dust, water/moisture, and salt. These card-level packaging solutions, compatible with modern embedded cooling techniques, facilitate effortless integration. The development of natural convection, forced air, conduction/baseplate, liquid, and hybrid cooling solutions characterizes the company's approach at the system level.

Curtiss-Wright Engineering Services

Thermal Analysis
Thermal Analysis
Optimizing Thermal Management for Enhanced System Reliability
Structural Analysis
Structural Analysis
Designing to Withstand the Demands of Rugged Environments
Signal Integrity Analysis
Signal Integrity Analysis
Ensuring the Highest Performance of Signal Integrity
Integration & Test
Integration & Test
Troubleshoot and/or Debug all Types of System Integration and Verification Testing Procedures
EMII/EMC Testing
EMII/EMC Testing
Environmental, Reliability, EMI and EMC Testing
System Integration
System Integration
Seamlessly Integrating Complex Systems for Optimal Performance

Cooling Approaches

Air-Flow-Through (AFT)
Air-Flow-Through (AFT)
Ideal for high density, high power (150-200W) computing applications where conductive or convective cooling methods are less viable
Conduction Cooling
Conduction Cooling
Ideal for lower density (50W) computing applications that require ruggedization.
Convection Cooling
Convection Cooling
Transfer of heat from electronics into the ambient air using airflow
Liquid-Flow-Through Cooling
Liquid-Flow-Through Cooling
LFT cooling uses a liquid-cooled system to cool cards from 200-1000W.
Fluid-Flow-Through Cooling
Fluid-Flow-Through Cooling
FFT cooling uses fixed channels (air-cooled or liquid-cooled) built into the chassis to cool the electronics.