Curtiss-Wright distinguishes itself from other electronic packaging suppliers by specializing in engineered packaging solutions, primarily for rugged government, military, and aerospace applications. Our solutions are designed using a modular open systems approach to be aligned with CMOSS, SOSA, GVA, and other essential technology standards for interoperability and sustained technology relevance.
Our thermal, structural, and signal integrity engineering expertise delivers predictable, reliable performance for all aerospace and defense missions, from small-form-factor to high-performance embedded computing modules, chassis, and systems.
Curtiss-Wright processing technologies are designed with MIL-STD qualification in mind and scale across VPX (VITA 46), VPX REDI (VITA 48), OpenVPX (VITA 65/68), VME64x, and small form factor architectures. The technology building blocks we develop are also ideally suited to developing purpose-built solutions quickly, with significantly reduced program risk.
Reliable Performance Through Better Cooling Technologies
Expelled heat from processors functioning at full performance cause reliability and determinism problems for mission-critical applications. When computer components get too hot, they do not perform to their designed specifications, become unreliable, and deliver variable processing performance. We have developed the most efficient and effective natural and forced air, liquid, and hybrid cooling technologies to keep these systems running reliably and performing as designed.
Our proven conduction cooling technology (ANSI/VITA 48.2) delivers reliability in a highly rugged package. Our air-cooled technologies are optimized to manage air streams enabling payloads cards and their associated mezzanine cards to remain cool.
To cool payloads with higher power requirements associated with the latest generation of data center CPU, FPGA, and GPU processors, our Air-Flow-Through (AFT – ANSI/VITA 48.8) technology is relied upon. When processing density is at its highest, our Liquid-Flow-Through (LFT – ANSI/VITA 48.4) and fluid-flow-through (FFT) technologies are trusted to remove more waste heat than any other approach.
Curtiss-Wright cooling technologies are engineered to deliver reliable, deterministic processing performance while building in ease of maintenance and EMI, dust, water/moisture, and salt protection.
Our card-level packaging solutions are compatible with efficient modern embedded cooling approaches for ease of integration. We have developed natural convection, forced and air conditioning, conduction/baseplate, liquid, and hybrid cooling solutions at the system level.
Ideal for high density, high power (150-200W) computing applications where conductive or convective cooling methods are less viable
Ideal for lower density (50W) computing applications that require ruggedization
LFT cooling uses a liquid-cooled system to cool cards from 200-1000W.