Expertise for Aerospace & Defense Electrical Engineering

Curtiss-Wright electrical engineers work with our customers to apply technical and creative expertise to ensure that our products meet our customer's program requirements. Our engineering team specializes in rapid product design and development for a broad and diverse range of products, providing solutions that lower costs throughout the product’s lifecycle. Our design capabilities range from board-level products and integrated subsystems to full turnkey product designs. Design and analysis modules are utilized to provide optimum designs for test and designs for manufacturing. Our broad range of engineering 

  • Single Board Computer (SBC) Design
  • Mixed Technology Backplanes
  • Rigid-Flex-Rigid Harnessless Designs
  • Radiation/TEMPEST Hardened Designs
  • I/O Card Design
  • Backplane Design
  • RF Design
  • Signal Integrity Analysis
  • DO-254 Design, development and certification


 

Our electrical engineering capabilities include:
 

  • 3U and 6U (VPX and VME) line replaceable modules (LRM)
  • PMC/XMC/FMC mezzanine modules
  • Fully integrated LRM-based subsystems
  • Small and Ultra-Small form factor line replaceable units (LRU)
  • Communication Interfaces (10/100/1000 Ethernet, ARINC 429, MIL-STD-1553, serial port RS-422/RS-485/RS-232, USB, SPI bus, CANbus)
  • I/O Interfaces (Digital I/O, Analog I/O, Analog to Digital designs, Digital to Analog designs, Synchro, resolver and encoder interfaces)
  • Power Systems (AC/DC Power Supplies, low voltage (28V) and high voltage (610V) motor control)
  • Control and Measurements (hand controllers, Gyroscopes, Rate Sensor system, RTD interface)
  • Backplane Designs (OpenVPX, VPX, VPX-REDI, VXS, VMEbus, CompactPCI, RF, and Mixed Technology)
  • Rigid-Flex-Rigid Board Designs
  • Radiation Hardened and Electro-Magnetic Pulse tolerance Designs
  • High performance circuit board simulation and design
  • FPGA and CPLD Design
  • Component Analysis (RoHS Compliance, Parts Obsolescence)
  • Advanced signal integrity analysis for high-speed signaling greater than 10 Gbaud per pair
  • RF design
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