Taken to the extreme, today’s high-end graphics processors (GPUs) can execute thousands of simultaneous operations, which is fundamental for highly parallel 3D visualizations and complex AI [artificial intelligence] processing tasks.

Much of the innovation in high-performance embedded computing starts with microprocessors.

FTI solutions on display will include a compact TSPI unit, a TmNS-compatible bi-directional RF communication system, a compact and modular all-in-one telepack, and real-time FFT processing for telemetry bandwidth optimization

New S-band mTTS-100-1 multimode transmitter supports Curtiss-Wright MnACQ, McDAU, and MDW-2020 data acquisition stacks with optional data encryption.

Rugged COTS processing and graphics display modules provided with AC 20-152A safety certification artifacts that support system certification up to DAL-A.

Telemetry is critical for the aviation industry to deliver new products. It’s a key asset to aerospace research, testing and FAA certification.

SOSA™-aligned CHAMP-XD3 DSP engine with new 10-Core Intel Xeon D-1700 processor delivers more scalable processing power with advanced security features for modern defense systems

Designed with Intel® Xeon® D processor architecture, Curtiss-Wright's CHAMP-XD1 processor card is ideally suited for compute-intensive aerospace and defense applications, meeting the high performance, reliability, and security standards these industries require.