New trusted and secure Parvus DuraCOR 8044 brings Intel® Xeon® W 8-Core processing in ultra-rugged design to air, ground and maritime platforms

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

The Sensor Open Systems Architecture Technical Standard (SOSA) – which will bring many benefits to designers of radar systems – will also have a beneficial effect on the design of electronic warfare (EW) systems.

To maintain warfighter overmatch, the US military must deploy advanced technologies for situational awareness to the edge of the battlefield.

New computer boards offer high performance, thermal management, and peripherals in a smaller size than 3U VPX, with artificial intelligence (AI) and GPGPU processing.

Choosing a single vendor for a complete video management system massively reduces program risks and costs.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.