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Keeping it cool for FVL

January 09, 2018

Helen Haxell looks at how ANSI/VITA 48.8, could soon be applied to the next-generation of aircraft, including Future Vertical Lift (FVL).

VITA 48.8, Future Vertical Lift, FVL,

Intel's Xeon-D 10 Gig connectivity drives demand for VITA 76 connector high-speed signal integrity

December 12, 2017

Mike Southworth looks at how the recent introduction of Intel's first Xeon System-on-a-Chip (SoC) device, the Xeon-D (codenamed "Broadwell DE"), dramatically changes the range of options for designers of high-performance small-form-factor (SFF) mission computers.

Intel, Xeon-D, Broadwell, SOC, VITA 46

Truly rugged and proven reliable: VITA 47 and beyond

November 27, 2017

Aaron Frank and Ivan Straznicky look at VITA 47. The American National Standards Institute (ANSI) standard VITA 47 gives system integrators a baseline for reliable and rugged products.

VITA 47, rugged, reliable, ANSI

Scale Down Rugged Mission Computers…and Still Boost Performance?

November 27, 2017

The Xeon-D SoC has more cores and threads per CPU (up to 16 cores/32 threads), helping designers upgrade mission computers without the SWaP concerns.

Mission Computer, Intel Xeon D

ANSI/VITA 48.8 Urges More Convection Cooling for VPX-Based Systems

November 15, 2017

The newly ratified ANSI/VITA 48.8 standard looks to reduce the dependence on conduction cooling for 3U and 6U circuit cards with VPX connectors.

Power electronics

Getting up to speed on NSA-approved two-layer commercial encryption

November 15, 2017

Paul Davis looks at how CSfC allows system designers to now deploy a commercial off-the-shelf (COTS) solution with encrypted data protection for Type 1 products reducing time and cost.

encryption, NSA, Csfc, data-at-rest, secure data

VITA 48.8 Air-Flow Cooling Almost Doubles Avionics Payload

November 10, 2017

William Wong from Electronic Design looks at how the VITA 48.8 standard could revolutionize rugged and airborne systems, especially those constrained by SWaP issues.

Air Flow Through, Vita 48.8, 3U VPX Cooling

ANSI/VITA 48.8 Ratification Opens Gates for New Embedded Cooling, RF and Microwave Cooling

October 26, 2017

John Keller from Military & Aerospace looks at how two U.S. standards organizations have ratified an open-systems specification for advanced air-flow-through cooling in high-performance embedded computing, RF and microwave applications.

air-flow-through cooling

COM Express hot among military electronics users while CompactPCI levels off

October 18, 2017

John McHale speaks to Mike Southworth about COM Express, the fastest growing standard, thanks to its flexibility and reduced size, weight, and power (SWaP) characteristics.

COM Express, CompactPCI

Zen and the Art of HPEC Software Debugging

September 18, 2017

Tammy Carter looks at how debugging tools are expanding the ability to produce quality and more robust software for HPEC systems.

hpec, software debugging,

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