Liquid Cooling: Thermally Managing Next-Generation Avionics

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April 12, 2019

Liquid Cooling: Thermally Managing Next-Generation Avionics

Published in Avionics International                              
Article Written by Woodrow Bellamy III

As aircraft embedded systems grow in complexity and the aviation industry embraces hybrid electric power, new methods of cooling are emerging to resolve thermal management and overheating challenges

The next generation of business and commercial jets, military aircraft and electric hybrid vertical take-off and landing vehicles will require avionics systems to do things they have never done before, including most prominently the support of artificial intelligence and machine learning applications. 

These next-generation platforms are also going to require levels of processing power and power generation that aircraft have never seen onboard before. Here, we analyze how emerging methods such as liquid cooling can help the industry address thermal management and overheating challenges presented by ever-shrinking aircraft computing architectures that must achieve ever-expanding levels of processing and functionality.

Liquid Cooling for Aircraft Embedded Computing

Ivan Straznicky, chief technology officer of advanced packaging for Curtiss-Wright describes thermal management and overheating challenges as a two-part problem. First, every generation of silicon devices, processors, field-programmable gate arrays (FPGAs), and chips features a new level of more advanced functionality, resulting in high levels of heat and power dissipation which is difficult to maintain and cannot be capped.

“20 years ago we were developing 6U cards that would produce around 20-watts of power. Now, in some cases with our most advanced products, we’re around 200 watts with forecasts for continued increases,” said Straznicky.  

According to Straznicky, thermal management challenges start at embedded computer chips but also need to be addressed at the board, chassis, and system level. All embedded components and systems at some point dissipate heat into the ambient air external to the aircraft and the air that is already circulating within the aircraft.

Historically, embedded systems suppliers have addressed thermal management challenges within avionics designs with methods such as conduction cooling at the card or module level. That type of cooling approach dissipates heat across the conduction-cooled interface and into an air-cooled or liquid-cooled chassis

Read the full article here.

Cooling Techniques

Liquid-Flow-Through Cooling  
Liquid-Flow-Through Cooling
Fluid-Flow-Through Cooling  
Fluid-Flow-Through Cooling
Air-Flow-Through (AFT) Cooling  
Air-Flow-Through (AFT) Cooling
Conduction Cooling  
Conduction Cooling
Convection Cooling  
Convection Cooling

Thermal Management in Rugged Computer Systems

This white paper looks at the different cooling techniques available including conduction, convection, Air-Flow-Through (AFT), Liquid-Flow-Through (LFT), and Fluid-Flow-Through (FFT) and aims to provide clarity on how to choose the best solution.