How Intel Xeon D can boost compute power AND solve sensor fusion challenges

April 11, 2017 | BY: Marc Couture

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Without a doubt, the Intel Xeon D represents the most significant device for the Defense Industry in a while. This isn’t just because it is a true System-On-Chip in an extended temp BGA package, but because it is a whole family of Xeon D chip SKUs with a common footprint. Board developers such as Curtiss-Wright can produce a single PCB that can then hold any one of the Xeon D SKUs, enabling the application developer to choose the best Xeon D for the job. The trade space at this silicon SKU level includes number of cores vs. TDP vs. clock frequency vs. standard or extended temperature. 

A different trade can be made at the board level in terms of architectural optimizations. As per Figures 1a and 1b, Curtiss-Wright is currently producing two 6U OpenVPX modules based on the Intel Xeon D, the CHAMP-XD2 and the CHAMP-XD2M. The XD2 contains two Xeon D devices with up to 32 GBytes of DDR4-2133 each, providing up to 32 cores on a single module in total. In contrast, the XD2M contains a single Xeon D with up to 16 cores, however 128 GBytes is available to the processor. Another way to look at it is the CHAMP-XD2 provides for 2 GBytes per Xeon D core as opposed to the CHAMP-XD2M, which provides for 8 GBytes per core, keeping in mind that the XD2M has half the core count as the XD2 per VPX board slot. 

  Figure 1a: CHAMP-XD2 for more COMPUTE   Figure 1b: CHAMP-XD2M for more MEMORY

The needs of the sensor processing application should dictate which board architecture makes the most sense. If the application is compute bound with VPX slot-count constraints, then the CHAMP-XD2 is the clear winner. In other words, if you need as many Xeon D cores as possible per a given subset of board slots, the CHAMP-XD2 is the way to go. Other applications may however be memory bound, in which case throwing more compute cores at the problem does not provide the solution. High data-rate sensor ingest applications (e.g. Sensor Fusion) and mobile server (e.g. Hypervisor VMs) may favor maximum memory capacity, in which case the CHAMP-XD2M is the clear choice as four times the amount of memory capacity is available for data ingest, cueing, etc. Some payloads may have multiple sensor processing stages and/or functions, in which case both modules may need to be present within the same OpenVPX chassis. The combination of Intel Xeon D chips and Curtiss-Wright CHAMP-XD boards represents the ultimate in flexibility and optimized performance for the application developer.  

Download our Intel Xeon D: A Significant Leap Forward White Paper to read more about:

  • Intel Xeon D
  • Using a common technology for multiple applications
  • Maximizing compute power
  • Overcoming sensor fusion challenges
  • Tackling the mobile server

Author’s Biography

Marc Couture

Senior Product Manager for Intel, Power Architecture, and GPGPU based Digital Signal Processors

Marc Couture is the Senior Product Manager for Intel, Power Architecture, and GPGPU based Digital Signal Processors in the ISR Solutions group at Curtiss-Wright. He has worked in the Embedded COTS industry for over 20 years having specialized in High Performance Embedded Computing and RF/Microwave technologies. Marc is a graduate of the University of Massachusetts Dartmouth with a Masters of Science in Electrical Engineering.

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