Leveraging Curtiss-Wright's extensive 3U OpenVPX ecosystem, these modules form the centerpiece of new small form factor HPEC system architectures. These very high performance Intel Xeon D-based digital signal processing products provide industry leading performance within strict SWaP constraints and are backed by world-class customer support and lifecycle management to support the programmatic needs of defense customers. Available in 3U VPX, the Curtiss-Wright COTS Intel Xeon D DSP cards include air-cooled and conduction-cooled ruggedization levels.

These open architecture COTS modules feature high-speed DDR4 memory as well as cutting edge bandwidth along the OpenVPX data, expansion, and control planes, creating a module architecture that can fully utilize the multi-core performance of Xeon D processors.  The new board family makes it easy for customers to extend their applications across different platforms and payloads, enabling system designers to fully leverage their investment in software development.

To maximize system configuration flexibility, these size, weight, power and cost (SWaP-C) optimized modules also feature XMC card expansion and the choice of 1 Gigabit or 10 Gigabit Ethernet (GbE) interfaces along the control plane.

  Product Name Product Type Form Factor Standard Processor/FPGA(s) # of CPUs Mezzanine Backplane Fabric
CHAMP-XD1/VPX3-482 3U VPX Intel Xeon D DSP Processor Card CHAMP-XD1/VPX3-482 3U VPX Intel Xeon D DSP Processor Card DSP 3U OpenVPX, VPX, VPX-REDI Intel Xeon D XMC PCIe - Gen 3, Gigabit Ethernet, 10 GbE, USB

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