CHAMP-XD1/VPX3-482 3U VPX Intel Xeon D DSP Processor Card

The 3U OpenVPX CHAMP-XD1 (VPX3-482) rugged digital signal processor (DSP) engine module is designed for use in very compute-intensive Industrial, Aerospace & Defense applications, enabling developers of High Performance Embedded Computing (HPEC) systems to take full advantage of the unmatched performance of today’s leading-edge Intel Xeon processor D architecture.

The CHAMP-XD1 combines the high core count and floating-point performance of the latest Intel Xeon D processors with the substantial bandwidth and system-enabling features of the VITA 3U OpenVPX form factor. Providing an extended temperature Intel Xeon D processor with 8 or 12 cores, the CHAMP-XD1 DSP processor has a peak performance of 410 GFLOPS or 576 GFLOPS respectively. This is coupled with 16 or 32 GB of high capacity DDR4-2133 with a bandwidth of >17 GBps per channel with two channels per processor.

For high speed data transport, the CHAMP-XD1 supports 1 Gigabit (Gb) or 10 Gigabit Ethernet (GbE) interfaces along the OpenVPX control plane in addition to PCI Express Gen 3 on the data plane. The CHAMP-XD1’s XMC mezzanine site (designed for up to 25W of thermal dissipation) adds even more configuration flexibility, with a myriad of mezzanine cards available from both Curtiss-Wright and other industry vendors.

The CHAMP-XD1 DSP Processor Card is available in a range of ruggedized configurations to deliver optimal performance in the harshest deployed environments, including air-cooled and conduction cooled variants. There is also resident a core function field programmable gate array (FPGA) used for TrustedCOTS security and general purpose I/O in addition to a dedicated Intelligent Platform Management Interface (IPMI) FPGA used for system monitoring and health.

The CHAMP-XD1 is supported by a suite of firmware, Operating Systems (OS), communication Application Programming Interfaces (APIs) and signal processing libraries. In particular, the OpenHPEC Accelerator Suite is Curtiss-Wright’s software environment of integrated OS with board specific drivers, optimized messaging and data movement middleware, and high performance computational libraries. Developers of mixed systems will find a common set of features and software interfaces for all future processing products from Curtiss-Wright.

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Key Features

  • Intel Xeon D 8-Core (410 GFLOPS @ 1.6 GHz) or 12-Core (576 @ 1.5 GHz)
  • Extended operating temperature Intel eTEMP SKUs
  • PCH integrated in Xeon D SoC
  • Native dual KR 10 GigE ports 
  • 16 to 32 GB DDR4 @ 2133 megatransfers per second (34 GB/s aggregate)
  • XMC PCIe up to Gen3, designed for up to 25W thermal dissipation
  • PCIe Gen3 on 3U OpenVPX data plane with switch
  • Core Function FPGA with IPMI
  • Conduction and air-cooled
  • TrustedCOTS



  • Multi-mode Radar 
  • Synthetic Aperture Radar (SAR)
  • Signal Intelligence (SIGINT)
  • Electro-Optical/Infrared (EO/IR)
  • Electronic Warfare (EW) 
  • Mission computing 
  • Industrial server applications 
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