CHAMP-XD2M 6U OpenVPX High Memory Capacity Intel Xeon D Processor Card
The 6U OpenVPX CHAMP-XD2M rugged Intel Xeon D module is designed for use in high memory capacity, compute-intensive Industrial, Aerospace and Defense applications, enabling developers of High Performance Embedded Computing (HPEC) systems to take full advantage of the unmatched performance of today’s leading-edge Xeon processor D architecture.
The CHAMP-XD2M combines the high core count and floating-point performance of the Xeon D processor with a massive 128 GB (maximum capacity supported by Xeon D) in addition to the substantial bandwidth and system-enabling features of the VITA 6U OpenVPX form factor. Providing a 16 core Intel Xeon D processor, the CHAMP-XD2M has a peak performance of 870 GFLOPS. This is coupled with 128 GB of high capacity DDR4-2133, with a bandwidth of >17 GBps per channel, two channels total of ECC memory.
For high speed data transport, the CHAMP-XD2M supports 40 G / 10 G Ethernet or InfiniBand on the data plane in addition to 1 Gigabit (Gb) or 10 Gigabit Ethernet (GbE) interfaces along the OpenVPX control plane. The CHAMP-XD2M’s XMC mezzanine site (designed for up to 25W of thermal dissipation) adds even more configuration flexibility, with a myriad of mezzanine cards available from both Curtiss-Wright and other industry vendors.
The CHAMP-XD2M is available in a range of ruggedized configurations to deliver optimal performance in the harshest deployed environments, including air-cooled and conduction-cooled variants. There is also resident a Core Function field programmable gate array (Xilinx UltraScale FPGA) used for TrustedCOTS security and general purpose I/O in addition to a dedicated Intelligent Platform Management Interface (IPMI) FPGA used for system monitoring and health.
The CHAMP-XD2M is supported by a suite of firmware, Operating Systems (OS), communication Application Programming Interfaces (APIs) and signal processing libraries as part of our ecosystem approach. In particular, the OpenHPEC Accelerator Suite is Curtiss-Wright’s software environment of integrated OS with board specific drivers, optimized messaging and data movement middleware, and high performance computational libraries. Developers of mixed systems will find a common set of features and software interfaces for all future processing products from Curtiss-Wright.
Leveraging Curtiss-Wright’s extensive 6U OpenVPX ecosystem, the CHAMP-XD2M forms the centerpiece of high memory capacity, high core count HPEC system architectures. Other Curtiss-Wright 6U OpenVPX modules available for HPEC configurations include the dual Xeon D based CHAMP-XD2, VPX6-1958/VPX6-1959 Single Board Computers, VPX6-6802 Ethernet/InfiniBand Switch, CHAMP-GP GPGPU Processors, and CHAMP-FX4 FPGA-based ADC/DAC modules.
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- CHAMP-XD2M High Memory Capacity Multi-Core HPEC Module based on the Intel Xeon Processor D
- CHAMP-XD2 Product Sheet
- White Paper: Deploying HPC Tools into Embedded Software Development to Save Time and Money
- White Paper: Deployable Core Counts Explode with Intel's Xeon D Processor
- Xeon D 16-core processor (870 GFLOPS @ 1.7 GHz)
- Alternative Xeon D SKUs available
- 128 GB DDR4 @ 2133 MT/s (34 GBps over 2 ECC channels)
- Four ports of 40G/10G Ethernet or DDR/QDR/FDR10 InfiniBand on OpenVPX data plane
- Native dual KX 1 GigE or KR 10 GigE ports on OpenVPX control plane
- XMC PCIe up to Gen3, designed for up to 25W thermal dissipation
- Dual x16 PCIe Gen3 on OpenVPX expansion plane with switch
- PCH integrated in Xeon D SoC
- Core Function FPGA (Xilinx UltraScale) and IPMI (Microsemi SmartFusion)
- Air and conduction-cooled
- Sensor fusion
- Mobile platform server
- Synthetic Aperture Radar (SAR)
- Signal Intelligence (SIGINT)
- Electro-Optical/Infrared (EO/IR)
- Mission computing
- Industrial server applications
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