Air Flow Through (AFT) Cooling
AFT technology uses a heat exchanger frame which prevents the cooling air from coming in contact with the electronics. On both the inlet and the exhaust sides of the card, a gasket mounted inside the chassis seals the card’s internal air passage to the chassis side walls. These seals prevent air from being blown into the chassis and protect the internal electronics from the harsh external environment
With component power, overall module power, and heat density continuing to increase, Curtiss-Wright is leading the way in rugged, 3U VPX Air-Flow-Through technology with our 3U AFT chassis. For systems requiring high power densities, AFT cooling is one of the most reliable active cooling solutions. By providing a thermal path of the least possible resistance, the 3U AFT cooled chassis from Curtiss-Wright can handle thermal loads up to 100W per system slot.
Let’s look at how AFT cooling works.
AFT technology passes air through the heat frame, preventing the ambient air from contacting the electronics, while dramatically decreasing the thermal path to the cooling air. The modules are enclosed in a thermal frame with openings for inlet and outlet air. On both the inlet and the exhaust sides of the card, a gasket mounted inside the chassis seals the card’s internal air passage to the chassis sidewalls. These seals prevent air from being blown into the chassis and protect the internal electronics from the harsh external environment.
Curtiss-Wright’s 3U VPX AFT chassis is Size, Weight, Power, and Cost-optimized.
While existing 6U AFT technology uses wedgelock retainers and insertion/extraction levers, Curtiss-Wright’s new 3U chassis contains no wedgelock retainers and can use jackscrews instead of levers.
It also gives the option of using a lighter material for the chassis. These factors greatly reduce weight and cost.
A great benefit of AFT is that the cooling air is brought in in very close proximity to the high power components. This allows for the highest performance possible.
In addition, every card is viewed in isolation from a thermal standpoint. This ensures balanced airflow through all of the cards.
Curtiss-Wright’s 3U AFT module technology will help drive a new class of lightweight chassis built from polymers or composite materials. Given the benefits of AFT, and the simplicity of its design, weight efficiency and low thermal resistance, AFT cooling is an ideal choice for rugged, high power, high-performance embedded applications. Contact Curtiss-Wright to learn more about this innovative 3U technology.