A SWaP-optimized Solution for Mission Computing
Today’s mission computers need efficient processing power and sophisticated graphics while operating in SWaP-constrained platforms. Curtiss-Wright meets the need with a unique product combination.
See the Conduction-cooled Solution in Operation
Running a graphics-intensive glass cockpit simulation, the application development software includes:
A Unique, Thermally Optimized Hardware Configuration
This solution inverts common practice. Instead of an SBC base card with a graphics mezzanine, it has a graphics base card with an SBC mezzanine. Extra heat from the graphics processor is dissipated across the 3U base, creating a great marriage between performance and thermal management.
A Fully Validated, Pre-integrated Board Set
VPX3-716 3U VPX Graphics Processor
- AMD E8860 GPU, able to run at full clock speed
- Six independent graphics outputs
- 2 GB of dedicated video memory
Video Transcript
Today’s mission computers need efficient processing power and sophisticated graphics while operating in SWaP-constrained platforms.
They empower warfighters with advanced mapping and visual applications needed for demanding missions. These applications deliver crucial information to the battlefield.
To do this, they need efficient processing power and advanced graphics in a rugged, SWaP-optimized package.
How can you achieve all this?
Curtiss-Wright meets the need with a combination of the VPX3-716 and the XMC-109, a rugged, conduction-cooled, 3U solution.
Let’s look at a real-world application. In a conduction-cooled 3U OpenVPX form factor, this solution is purpose-built to handle the rugged, high-performance visual applications essential for advanced mission computing. Running a graphics-intensive Glass Cockpit simulation, this system combines CoreAVI Software Drivers and the ANSYS HMI Development Tool.
Supporting visual applications is a design challenge, with graphics processors continually demanding more power and generating more heat. This system meets that challenge by inverting common practices. Usually, an SBC acts as the base card, with a graphics mezzanine. Here we see a graphics base card with an SBC mezzanine. Extra heat from the graphics processor is dissipated across the 3U base card, creating a great marriage between performance and thermal management.
Let’s look at the system’s different components and their benefits.
The high-performance VPX3-716 graphics hardware fits into a single 3U slot, saving you valuable space. It is built around the AMD E8860 GPU and delivers a supercharged 768 Gigaflops, with 6 independent graphics outputs, and 2 Gigabytes of dedicated video memory. The VPX3-716 is engineered to provide powerful graphics processing for the most demanding defense applications. It is ruggedized for shock, vibration, and extreme temperatures. With 3U thermal characteristics to let the E8860 run at full clock speed, so you get the performance you need. And an XMC site - which enables the second part of this solution.
The XMC-109 is a power-efficient processor mezzanine Single Board Computer based on NXP's (formerly Freescale) Power Architecture QorIQ P2020 dual-core processor. It delivers 5600 DMIPS of processing in under 18 watts, along with dual Ethernet, USB, serial ports, digital I/O, and SATA interfaces, plus up to 8 Gigabytes of DDR3 memory. It is a highly efficient, low-power processing engine.
This unique hardware combination occupies a single 3U slot. It is designed to meet your requirements for SWaP-optimized graphics and processing. With validated and tested development software, it is a complete platform for new applications. And that it reduces your design risk, cuts your up-front costs, and compresses your development schedules.