A Standard that Provides Cooling Solutions for Rugged Deployed Embedded Computing Systems

VPX Redi logo

The high-density electronic components that provide high-speed data transfer in military/aerospace rugged deployed embedded systems generate significant heat in enclosed spaces – so the VITA Standards Organization (which included Curtiss-Wright Defense Solutions) developed the standard for VPX-REDI (Ruggedized Enhanced Design Implementation).

VPX-REDI defines design parameters for enhanced cooling features and maintenance strategies to effectively support the increased power draw of high-density electronic systems. The standards guide the design and manufacture of modules that are rugged and easily maintained in deployed defense environments.VPX3-683

The VITA 48 standard defines the mechanical design requirements for commercial-off-the-shelf (COTS) platforms to enhance cooling methods, such as forced air, conduction and liquid cooling in defense and aerospace platforms. Specifically, VPX-REDI defines standards for the mechanical interface between the chassis and plug-in modules of embedded computing systems. VPX employs switch fabric technologies for high-speed data operations in 3U and 6U Eurocard format computer boards.

VPX-REDI also sets the standards for use of ESD (electrostatic discharge) covers on both sides of boards. Forced air cooling under VITA 48 uses baffles and plenums, while the conduction cooling method takes advantage of larger, efficient thermal interfaces.

The design standards developed for VPX-REDI design standards correspond with the OpenVPX architecture standards. They answer the Department of Defense’s increasing demand for ruggedized, cost-effective embedded computing solutions that can be rapidly deployed in new defense technologies – and provide reliable service under combat situations.

The VPX-REDI specifications ratified by the American National Standards Institute/VITA define mechanical specifications for:

  • Plug-in units that use increased slot pitch to deliver improved durability and enhanced thermal performance
  • Mechanical interchangeability of air-cooled plug-in units In both the 3U and 6U form factors and for ensuring Level 2 maintenance compatibility, which facilitates field replacement of components
  • Air flow-through cooling for 6U plug-in units, employing a compact core heat exchanger in the unit’s central heat sink

Infocenter

Reducing Development Time for High-Speed Embedded Data Collection A Curtiss-Wright customer required a high performance storage solution with at... MORE> Shipping Out a Canadian-Made Tech Refresh A customer wanted to update their ship-to-ship communications system. Read about... MORE> COTS Encryption for Data-at-Rest This white paper outlines how two-layer encryption can be leveraged with COTS... MORE> Taking the complexity out of PCI Express configuration to optimize HPEC system design Performance is all about eliminating bottlenecks to minimize latency and maximize... MORE> Intel Xeon D: A Significant Leap Forward in General Purpose Processor (GPP) Technology Across the Spectrum of Defense Applications This white paper will explore the technology behind the Xeon D’s flexibility and... MORE> Integrating Video Sources Integrating new cameras with existing helicopter cameras and displays can prove... MORE> COTS vs. Custom Graphics for Military Avionics This white paper looks at the evolution of COTS graphics module design and how it... MORE> Why real ruggedization matters for COTS FPGA hardware
in aerospace and defense applications
Denis Smetana looks at the challenges FPGA modules carry and how to best meet them. MORE>
Degraded Visual Environment (DVE) Video Degraded Visual Environment systems provide pilots with the advanced visual... MORE> Reducing Complex Integration Efforts with SWaP-C Optimized Video Switching This white paper discusses how small form factor Video Management Solutions allow... MORE> Dissecting Rugged Development of COTS FPGA Hardware This white paper discusses the challenges FPGA modules carry and how best to meet... MORE> Pervasive Coverage of the Electromagnetic Spectrum with a Next Generation COMINT/ELINT Signal Analysis Methodology, the All-to-All Architecture In this white paper, we explore how technological advances in multi-channel signal... MORE>
Connect With Curtiss-Wright Connect With Curtiss-Wright Connect With Curtiss-Wright
Sales

CONTACT SALES

Contact our sales team today to learn more about our products and services.

YOUR LOCATION

PRODUCT INFORMATION

Support

GET SUPPORT

Our support team can help answer your questions - contact us today.

REQUEST TYPE

SELECT BY

SELECT Topic