Intel is a world technology leader, enjoying a stellar reputation for the absolute highest performance in commercial processor technologies.

Today’s embedded, aerospace and defense industries rely heavily on modern commercial technology to meet the demanding power, size, and performance requirements of today’s mission-critical systems. Intel’s Tick-Tock technology cadence, which alternates microarchitecture advancements with power saving die geometry shrinkage, has produced continuous performance improvements with reliable, scalable processing options available to suppliers of Single Board Computers (SBCs) and DSP engines for use in embedded control, processing, and compute-intensive applications.

As an Intel Technology Partner, Curtiss-Wright works closely with Intel to select only specific Intel processors supported within Intel’s embedded technology group. These processors enjoy long life availability and meet the high reliability requirements that Curtiss-Wright products demand for the long-term success of your programs. Download whitepapers to learn more about these technologies.
 

Intel Processing Solutions from Curtiss-Wright

Curtiss-Wright offers Intel processing modules in 3U, 6U, and mezzanine form factors meeting open industry standards such as OpenVPX, VME, and XMC. They are supported by a range of Operating Systems, Board Support Packages (BSPs), Signal & Data Processing Libraries, Shared Memory Drivers for high-speed board-to-board communications, and our recently announced OpenHPEC Accelerator Suite enabling your teams to bring applications to market quickly. Many of Curtiss-Wright's Rugged Mission Computers incorporate Intel processors.

Single Board Computers
3U VPX   6U VPX   VME  
  • VPX3-1220 Intel 7th Gen "Kaby Lake" Xeon SBC
  • VPX3-1259 Intel 5th Gen Core i7 "Broadwell" SBC
  • VPX3-1258 Intel 4th Gen Core i7 "Haswell" SBC
  • VPX3-1257 Intel 3rd Gen Core i7 "Ivy Bridge" SBC
  • VPX6-1959 Intel 5th Gen Core i7 "Broadwell" SBC
  • VPX6-1958 Intel 4th Gen Core i7 "Haswell" SBC
  • VPX6-1957 Intel 3rd Gen Core i7 "Ivy Bridge" SBC
XMC
  • XMC-121 Intel "Kaby Lake" Xeon SBC
  • XMC-120 Intel Atom "Bay Trail" SBC
Digital Signal Processors
3U VPX  6U VPX  /products/cots-boards/processor-cards/intel-dsp/ VME 
  • VPX3-482 Champ-XD1 Intel Xeon D DSP Processor Card
  • VPX6-483 Champ-XD2 Intel Dual Xeon D DSP Processor Card
  • VPX6-463 Champ-AV9 Intel Dual 4th Gen Core i7 "Haswell" DSP Processor Card
  • VPX6-462 Champ-AV8 Intel Dual 3rd Gen Core i7 "Ivy Bridge" DSP Processor Card
  • SVME/DMV-417 Champ-AV5 Intel Dual 1st Gen Core i7 "Arrandale" DSP Processor Card
Software Support
OpenHPEC Accelerator Suite OpenHPEC Math Libraries OpenHPEC Accelerator Suite Quick Start Kit
Rugged Mission Computers
     3U MPMC Mission Computers
     

 
     6U MPMC Mission Computers
     
 
      DuraCOR Mission Computers

         
 

 

SWaP-Optimized for Rugged Deployed Platforms

Intel processing modules from Curtiss-Wright combine multi-core processing capabilities, ECC protected memory subsystems, high-speed I/O, and some with advanced graphics capabilities, all in embedded form factors. Curtiss-Wright’s innovative thermal management designs at the subsystem level have enabled us to reliably integrate Intel Core processors across extended temperature ranges using advanced cooling methods, resulting in reliable and deterministic performance even at high operational temperatures.
 

Integrated GPUs Save You Even More Space

Incredible advancements with Intel’s integrated Graphics Processing Units (GPUs) have pushed the performance of their latest Core architecture chips beyond those of yesterday’s discrete GPUs. Whether used with OpenGL™ for mapping and graphics applications, or with OpenCL™ libraries to accelerate ISR and signal processing algorithms, these integrated GPUs combine incredibly high performance with low latency and increased security, while at the same time saving you valuable space, power and overall system complexity and costs.  
 

Picking the Right Processor for the Application

     
  The recently announced Xeon® D processor offers the highest compute performance for embedded applications. With up to 16 Broadwell processing cores, each supporting AVX2 math acceleration engines, the Xeon D offers unprecedented processing power in a highly integrated System on a Chip (SoC). Native 10 GigE ports and a DMA engine for PCIe Gen 3 in the Xeon D represent key additions for system designers.

The Skylake Xeon E3-1505 processor, formerly Skylake-H, combines quad-core hyper-threading Xeon processing with an integrated GPU – offers essentially the same functionality as the Core i7 family.  
     
  Intel’s Core™ i7 family combines quad-core hyper-threading performance with an integrated graphics GPU engine for high performance computing, control, and graphical display applications. With a wide range of supported operating systems and powerful virtualization capabilities, the Core i7 family offers outstanding performance-per-watt capabilities with unprecedented levels of integration and application flexibility. 
     
  Intel also has a line of low-power processors with mid-level performance. In the latest Atom™ product family, Intel has identified their Bay Trail Atom processor as meeting the unique low power requirements for the embedded market, packing a powerhouse of features with quad-core performance onto an SoC while consuming less than 10 watts of power. 

 

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