With the increased use of Commercial Off the Shelf (COTS) hardware in today’s aerospace and defense military systems, products need to be designed and tested to ensure performance remains as expected under extreme conditions. COTS vendors also need to be able to provide the necessary data to system integrators to enable the most effective design for their systems.
Field Programmable Gate Array (FPGA) processing modules provide unique challenges for rugged, deployed applications and often require some extreme ruggedization testing to meet the demands. This white paper discusses the challenges FPGA modules carry and how best to meet them. This includes the technical design enhancements, the qualification process, as well as providing sufficient data to understand how the product may perform under the target configuration in a rugged environment.
Figure 1: FPGAs need to be tested in extreme temperatures for proper qualification.
Download the white paper to learn more.
- Ruggedization challenges
- Capacity, frequency, and leakage current
- Convection, conduction, and AFT cooling
- Qualification processes for FPGAs
- VITA 47