VPX

The specification defines OpenVPX profiles for slots, backplanes and modules to assure boards can be replaced by other boards with only minimal backplane changes. It also adds air-cooled Line Replaceable Module plug-and-play interoperability through the use of Rear Transition Modules (RTMs).

The standard defines OpenVPX system topologies to promote interoperability. The OpenVPX slot types include payload, peripheral, switch and storage. In addition, the OpenVPX backplanes include star, mesh, hybrid and bridged topologies. The specification also discusses the Utility Plane, Power Distribution, System Control Signals, the Reference Clocks and the GPIO Signals. Pin Assignments are defined for J0/P0 and J1/P1.

Curtiss-Wright is a leading supplier of boards and systems designed to be compliant with OpenVPX (VITA 65). We are proud of our role as a leading participant in the open standards process that resulted in the ANSI ratification of VITA 65.

VPX-REDI (VITA 48) was inspired by the need for higher density electronics, increased power draw that requires more effective cooling strategies, and rugged and maintainable modules. VPX-REDI defines design parameters for enhanced cooling features and maintenance strategies to effectively support the increased power draw of high-density electronic systems. It also defines standards for the mechanical interface between the chassis and plug-in modules of embedded computing systems. VPX-REDI targets the requirements of COTS platforms for defense and aerospace, defining mechanical design implementations for embedded computing modules with three primary design objectives:

• Accommodating cooling methods that include forced air, conduction, and liquid cooling.
• Adding features compatible with ESD covers required for two-level maintenance strategies.
• Facilitating module designs with components on the secondary side of the circuit board.

The VPX-REDI specifications ratified by the American National Standards Institute/VITA define mechanical specifications for:

• Plug-in units that use increased slot pitch to deliver improved durability and enhanced thermal performance
• Mechanical interchangeability of air-cooled plug-in units In both the 3U and 6U form factors and for ensuring Level 2 maintenance compatibility, which facilitates field replacement of components
• Air flow-through cooling for 6U plug-in units, employing a compact core heat exchanger in the unit’s central heat sink