Curtiss-Wright Introduces Its Highest Performance 3U OpenVPX Digital Signal Processing Engine
SOSA™-aligned CHAMP-XD3 DSP engine with new 10-Core Intel Xeon D-1700 processor delivers more scalable processing power with advanced security features for modern defense systems
What You Need to Know About the Telemetry Network Standard
The TmNS is an emerging technology for the major flight-test ranges in the U.S. By allowing for bidirectional data and control, this upgraded ground infrastructure is a significant step forward for the flight-test community.
Securing Telemetry Data with Commercial Encryption Standards Article from Military Embedded Systems
Telemetry data from military flight tests often needs to be secured, not only when at rest, but also while in motion across a network or a telemetry link.
Curtiss-Wright Displays and Demonstrates New FTI Hardware and Software Solutions at ITC 2021
Curtiss-Wright will showcase its newest FTI solutions, including TmNS compatible bi-directional RF communication and PCM backfill, a new compact and modular all-in-one telepack, and IADS post-test explorer, a purpose-built post-test reporting software.
Curtiss-Wright Introduces its Smallest, Fastest Flight Test Network Recorder
New nREC-700 miniature recorder captures 1TB of sensor data over dual Gigabit Ethernet ports.
Artificial Intelligence Applications for the Military at the Network Edge
Edge computing can takes the necessary processing power away from data centers to the network’s edge.
Curtiss-Wright Enhances MIL-grade Rugged SFF Computer with Industrial-Grade NVIDIA Jetson AGX Xavier for AI/ML/Edge Computing
Parvus DuraCOR AGX-Xavier delivers high-performance NVIDIA GPU-accelerated processing and deep learning engines in ultra-rugged SFF mission computers designed for extreme aerospace and defense applications.
Curtiss-Wright Boosts Ruggedization of 6U OpenVPX Module with New Eight-Core Intel Xeon W-11000E Series Processor
VPX6-1961 SBC features the just announced eight-core Intel Xeon W-11000E Series processor, qualified to deliver significant advances in integrated graphics and accelerated AI/ML processing at extreme temperatures and under demanding shock and vibration co