Rugged, military and avionic applications require the mantra of size, weight, power, and cost (SWaP-C) and this requires thermal management. The most demanding computing applications like artificial intelligence and machine learning push the performance envelope and require optimized thermal design. Cooling electronic systems and the high performance CPUs, FPGAs and GPUs deployed in harsh military environments is met with a range of thermal management techniques.
In this webinar, Bill Wong, Senior Content Director at Electronic Design, and Ivan Straznicky, CTO Advanced Packaging for Curtiss-Wright, discuss the cooling options available to system designers, thermal management technicques, and thermal management standards.