It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
Curtiss-Wright Debuts Compact, Rugged Tactical Fusion System
New PacStar TFS system, based on Intel® processors and NVIDIA® GPUs, combines high-performance processing and secure network connectivity to support tactical and expeditionary sensor fusion applications.