On Electronic Engineering Journal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

TSN is a set of standards and capabilities that enable hard real-time use cases over standard Ethernet networks.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

Time Sensitive Networking (TSN) is a set of Ethernet networking capabilities used to transmit time-sensitive data across standard Ethernet networks. Originally, TSN grew out of the IEEE 802.1 standard working groups on Audio Video Bridging (AVB) to make sure that independent networks streams for audio and video data arrive at the correct times to ensure synchronization.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

The standards currently being defined by the Sensor Open Systems Architecture (SOSA) Consortium will deliver many clear benefits to system integrators designing embedded sensor-processing systems. The SOSA Technical Standard will define common pinouts that foster and ease interoperability.