On Electronic Engineering Journal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.

Taken to the extreme, today’s high-end graphics processors (GPUs) can execute thousands of simultaneous operations, which is fundamental for highly parallel 3D visualizations and complex AI [artificial intelligence] processing tasks.

Much of the innovation in high-performance embedded computing starts with microprocessors.

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

TSN is a set of standards and capabilities that enable hard real-time use cases over standard Ethernet networks.

Industry standards and guidelines such as MOSA, SOSA, CMOSS, SAVE, and FACE are driving the latest developments in enclosures, chassis, and backplane databuses, as small for factors are ready to take center stage.

Designed with Intel® Xeon® D processor architecture, Curtiss-Wright's CHAMP-XD1 processor card is ideally suited for compute-intensive aerospace and defense applications, meeting the high performance, reliability, and security standards these industries require.

Optimized for performance, speed, security, and SWaP, Curtiss-Wright CHAMP-XD1 processor cards leverage Intel® Xeon® D processor architecture to meet the high demands of modern defense missions.