It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
New V3-717 3U OpenVPX graphics processor module supports DO-254 DAL A and FACE-aligned software drivers with well-sourced, long proven AMD Radeon E8860 GPU.