Parvus DuraCOR 313 USFF Mission Computer with Intel Atom x6400E

Parvus DuraCOR 313 USFF Mission Computer with Intel Atom x6400E
Parvus DuraCOR 313 USFF Mission Computer with Intel Atom x6400E
Product Sheet
Product Sheet

The Parvus DuraCOR 313 is an ultra-small form factor (USFF) rugged embedded computer based on a low-power, quad-core Intel® Atom™ x6400E Series (Elkhart Lake) processor equipped with unparalleled modularity for add-on I/O cards and data storage in a fanless IP67-rated miniature design.

Key Features

  • Miniature fanless embedded Intel Atom processor system:
    • Small size: ~5.2” x 5.4”x 2.0” (LxWxH)
    • Lighweight: < 2.0 lb (< 0.90 kgs)
    • Low power: <25W
  • Rugged IP67 chassis with high-density MIL-performance circular connectors
  • 1000BaseT Ethernet ports with TSN support (for real-time networking)
  • Modular I/O architecture: up to three slots for PCIe Mini-Cards (for add-on I/O)
  • Rugged solid-state data storage (mSATA/removable 2.5” SATA SSD)
  • Wide voltage input MIL-1275/704/DO-160 power supply for aircraft and ground
  • vehicles; optional 50ms power hold-up
  • Extreme MIL-STD-810G/DO-160 thermal,shock, vibration, altitude, humidity; also MIL-STD-461F/DO-160G EMI/EMC

 

Applications

  • In-vehicle and airborne rugged embedded computing and sensor integration
  • Civil and military SWaP-sensitive C4ISR and situational awareness upgrades
  • Fixed-wing and rotary helicopter platforms, industrial applications
  • Manned and autonomous vehicles (UAV, UUV, UGV, USV)
  • MIL-grade edge computing with deterministic Ethernet connectivity
  • Product migration path for DuraCOR 311
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Parvus DuraCOR 313 USFF Mission Computer with Intel Atom x6400E

The Parvus DuraCOR 313 is an ultra-small form factor (USFF) rugged embedded computer based on a low-power, quad-core Intel Atom x6400E Series (Elkhart Lake) processor equipped with unparalleled modularity for add-on I/O cards and data storage in a fanless IP67-rated miniature design.

Featuring MIL-performance circular connectors and industrial temperature components, this rugged Commercial Off the Shelf (COTS) processor is an ideal x86 mission computing solution for size, weight, power, and cost (SWaP-C) sensitive vehicle, airborne, industrial, manned, and unmanned vehicle and sensor applications. Optimized for high-performance energy-efficient processing and as a migration path for the legacy DuraCOR 311, the new 313 boasts significant CPU, GPU, memory, security, and networking performance improvements, including up to 16GB DDR RAM, 64GB EMMC on-board storage, 11th gen Intel HD Graphics, integrated CAN 2.0 / CAN FD interfaces, TPM security module, and low-latency Time Sensitive Networking (TSN) support.

Highly robust modular open systems approach (MOSA)-based mission computer

The ultra-reliable and modular design of the DuraCOR 313 features high mechanical robustness and I/O flexibility to meet the needs of industrial, military and aerospace platforms. This modular open systems approach (MOSA)-based unit features an extended temperature Intel-based Computer-on-Module (COM) tightly integrated with a non-volatile Flash Solid State Disk (SSD) and system carrier board, which provides up to three slots for optional add-on Mini-PCIe I/O modules (to add CANbus, 1553, ARINC429, other databus interfaces).

Removeable storage and Mini-PCIe modules

The unit integrates on-board eMMC Flash and supports an internal mSATA SSD, as well as optional removable 2.5” SATA SSD storage for high-capacity storage, data logging, and information assurance requirements. Like other DuraCOR models, the 313 can leverage a large ecosystem of rugged COTS Mini-PCIe modules together with Curtiss-Wright’s responsive, cost-competitive application engineering services to reduce program risk, cost and schedule impact for customer-tailored Modified COTS (MCOTS) variants.

On-board computing for civil and military aircraft and tactical/combat/industrial vehicles

With military-grade ruggedization for harsh embedded environments, the DuraCOR 313 is well suited for operation on-board civil and military aircraft and tactical/combat/industrial vehicle platforms.

Comprehensive qualification testing is planned to validate its robustness under MILSTD-810, MIL-STD-461, MIL-STD-1275, MIL-STD-704 and RTCA/DO-160 conditions for environmental, power and EMI (thermal, shock, vibration, dust, water, humidity, altitude, power spikes/surges, conducted/radiated emissions and susceptibility). In addition, optional 50 ms power hold-up capabilities are supported for MIL-STD-704 aircraft power switch-over requirements.

 

Size, Weight, Power and Cost

Today's aerospace, commercial and defense applications demand high performance in small form factors