On Electronic Engineering Jounal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

The standards currently being defined by the Sensor Open Systems Architecture (SOSA) Consortium will deliver many clear benefits to system integrators designing embedded sensor-processing systems. The SOSA Technical Standard will define common pinouts that foster and ease interoperability.

Ivan Straznicky talks about the challenges of keeping rugged computer systems designed for military programs cool under harsh conditions as they grow more powerful and more complex.

With faster processors, more functions, and higher bandwidth than ever before, today’s avionics are pushing the cooling technology envelope to the breaking point – and beyond.