On Electronic Engineering Jounal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.

Annual conference brings together leading suppliers of embedded systems, subject matter experts and international media

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

Rugged COTS processing and graphics display modules provided with AC 20-152A safety certification artifacts that support system certification up to DAL-A.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

TSN is a set of standards and capabilities that enable hard real-time use cases over standard Ethernet networks.

SOSA™-aligned CHAMP-XD3 DSP engine with new 10-Core Intel Xeon D-1700 processor delivers more scalable processing power with advanced security features for modern defense systems

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.