On Electronic Engineering Jounal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.
Rugged SOSA-aligned 6U VPX Embedded Computing Module Introduced by Curtiss-Wright
The CHAMP-XD4 features dual Intel Xeon D-2700 processors, and is for demanding intelligence, surveillance and reconnaissonce (ISR) system architectures.
For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.
It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.