It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

It can be laborious and time-consuming to troubleshoot and repair systems on aircraft. Without granular data, it can be difficult for maintenance personnel to identify what part of a system is faulty and it can take a long time to remove, test, and reinstall parts of a system until the culprit is found.

Additive manufacturing, also called 3D printing, is having an influence on military logistics, and helps supply personnel get replacement parts where and when they’re needed — even on the front lines.

Ivan Straznicky talks about the challenges of keeping rugged computer systems designed for military programs cool under harsh conditions as they grow more powerful and more complex.

With faster processors, more functions, and higher bandwidth than ever before, today’s avionics are pushing the cooling technology envelope to the breaking point – and beyond.

Until recently, the use of moving liquid to remove excess heat from embedded computing processors was considered an expensive and unreliable luxury, but escalating demand and maturing technologies finally are putting this technology within reach.