It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures
High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.
Additive manufacturing, also called 3D printing, is having an influence on military logistics, and helps supply personnel get replacement parts where and when they’re needed — even on the front lines.
Will Today’s Cybersecurity Guidelines and Standards Become Mandates for Connected Aircraft Systems?
Aviation cybersecurity mandates by the European Union Aviation Safety Agency (EASA) and the Federal Aviation Administration (FAA) are coming in the next two years.
Thermal Management in Rugged Computer Systems from Electronic Design
Ivan Straznicky talks about the challenges of keeping rugged computer systems designed for military programs cool under harsh conditions as they grow more powerful and more complex.
How Embedded Systems are Coping with the Heat of Today's Avionics
With faster processors, more functions, and higher bandwidth than ever before, today’s avionics are pushing the cooling technology envelope to the breaking point – and beyond.
Designers of Small Rugged Computers for the Battlefield Balance Size, Performance, and Cooling
Commercial off-the-shelf (COTS) components are being embraced so the technology can be serviced at the base instead of waiting for specialized parts or sending the system back state-side.
