It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
The Ever-Shrinking World of Small-Form-Factor Embedded Computing
New computer boards offer high performance, thermal management, and peripherals in a smaller size than 3U VPX, with artificial intelligence (AI) and GPGPU processing.
The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures
High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.
Today’s embedded-system designers have a great variety of processor types to select from, with FPGAs and GPUs adding their own various advantages and disadvantages for consideration in contrast to the more familiar CPUs.
Thermal Management in Rugged Computer Systems from Electronic Design
Ivan Straznicky talks about the challenges of keeping rugged computer systems designed for military programs cool under harsh conditions as they grow more powerful and more complex.