It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
The Modular Open Systems Approach directive has accelerated the adoption of a variety of Modular Open Systems Approach supporting standards, including SOSA, CMOSS, FACE, VICTORY, and GVA, by the Army, Air Force, and Navy.