It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
BATTLESPACE Editor, Julian Nettlefold interviewed Chris Wiltsey, Senior Vice President and General Manager of the Curtiss-Wright Defense Electronics Segment
The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures
High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.