On Electronic Engineering Jounal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.

New trusted and secure Parvus DuraCOR 8044 brings Intel® Xeon® W 8-Core processing in ultra-rugged design to air, ground and maritime platforms

Annual conference brings together leading suppliers of embedded systems, subject matter experts and international media

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

Rugged COTS processing and graphics display modules provided with AC 20-152A safety certification artifacts that support system certification up to DAL-A.

The new Link 22 capability seamlessly integrates with Curtis-Wright TCG TDL systems.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.