It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
The Modular Open Systems Approach directive has accelerated the adoption of a variety of Modular Open Systems Approach supporting standards, including SOSA, CMOSS, FACE, VICTORY, and GVA, by the Army, Air Force, and Navy.
The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures
High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.
Thermal Management in Rugged Computer Systems from Electronic Design
Ivan Straznicky talks about the challenges of keeping rugged computer systems designed for military programs cool under harsh conditions as they grow more powerful and more complex.
How Embedded Systems are Coping with the Heat of Today's Avionics
With faster processors, more functions, and higher bandwidth than ever before, today’s avionics are pushing the cooling technology envelope to the breaking point – and beyond.
