Showing 1 - 8 of 26
Military & Aerospace Electronics

Thermal-Management Techniques Take-on the Heat

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

10/27/2022
military and aerospace electronics

Embedded Computing Enclosures go Standard, and go Small

Industry standards and guidelines such as MOSA, SOSA, CMOSS, SAVE, and FACE are driving the latest developments in enclosures, chassis, and backplane databuses, as small for factors are ready to take center stage.

02/24/2022
Military & Aerospace Electronics

Is Thermal Management up to the High-performance Computing Challenge?

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

10/29/2021
Microwaves & RF

Open Standards Drive Flexibility in Defense System Designs

Backed by broad support from government and industry, the release of SOSA Technical Standard 1.0 promises a new era of open standards-based system integration with flexibility and interoperability as its hallmarks.

09/10/2021
Military Embedded Systems

Open Architecture Initiatives Bolster Unmanned Sensors and Systems

The advent of unmanned systems reflects a huge aspect of warfare – that of protecting the warfighter – through the development of platforms that can be operated by humans from a distance, keeping them out of harm’s way.

05/17/2021
Military & Aerospace Electronics

Artificial Intelligence and Machine Learning for Unmanned Vehicles

Military experts are developing new enabling technologies to help unmanned aircraft, ground vehicles, submarines, and surface vessels swarm and make decisions without human intervention.

04/28/2021
Military & Aerospace Electronics

The Ever-Shrinking World of Small-Form-Factor Embedded Computing

New computer boards offer high performance, thermal management, and peripherals in a smaller size than 3U VPX, with artificial intelligence (AI) and GPGPU processing.

04/01/2021
Military & Aerospace Electronics

The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

02/25/2021