Showing 1 - 8 of 45
Military & Aerospace Electronics

Thermal-Management Techniques Take-on the Heat

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

10/27/2022
Curtiss-Wright Defense Solutions Engineers Honored as Curtiss-Wright Technical Fellows

Curtiss-Wright Defense Solutions Engineers Honored as Curtiss-Wright Technical Fellows

Three members of Curtiss-Wright Defense Solutions engineering team recognized for excellence under Curtiss-Wright Corporation Technical Fellow Program

02/07/2022
Military & Aerospace Electronics

Is Thermal Management up to the High-performance Computing Challenge?

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

10/29/2021
Curtiss-Wright honored by Military & Aerospace Electronics Innovators Awards 2021

Curtiss-Wright Defense Solutions Products Honored by 2021 Military & Aerospace Electronics Innovators Awards

Curtiss-Wright tops the list of recipients with record eight innovators awards - one platinum, five gold, and two silver.

09/08/2021
BATTLESPACE

Pioneering Technology

BATTLESPACE Editor, Julian Nettlefold interviewed Chris Wiltsey, Senior Vice President and General Manager of the Curtiss-Wright Defense Electronics Segment

08/10/2021
Avionics International

Despite COVID-19, eVTOL Avionics Development Forges Ahead

Analysis of the latest technologies being developed by avionics OEMs for the emerging eVTOL market.

05/24/2021
NASA Space

A Piece of the Wright Flyer Flies on Mars

NASA has announced the first flight of an aircraft on another planet, and a piece of the Wright brothers' history gets to ride along.

04/09/2021
Military & Aerospace Electronics

The Evolution of Embedded Computing Chassis, Backplanes, and Enclosures

High data throughput and innovative thermal management may lead to a revolution in systems design that places the burden of electronics cooling on the enclosure more than on the card.

02/25/2021