On Electronic Engineering Jounal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.
For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.
It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.
The Modular Open Systems Approach directive has accelerated the adoption of a variety of Modular Open Systems Approach supporting standards, including SOSA, CMOSS, FACE, VICTORY, and GVA, by the Army, Air Force, and Navy.
Curtiss-Wright Debuts Compact, Rugged Tactical Fusion System
New PacStar TFS system, based on Intel® processors and NVIDIA® GPUs, combines high-performance processing and secure network connectivity to support tactical and expeditionary sensor fusion applications.
