Rugged SOSA-aligned 6U VPX Embedded Computing Module Introduced by Curtiss-Wright
The CHAMP-XD4 features dual Intel Xeon D-2700 processors, and is for demanding intelligence, surveillance and reconnaissonce (ISR) system architectures.
It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.
Is Thermal Management up to the High-performance Computing Challenge?
Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.