On Electronic Engineering Jounal's podcast program Fish Fry, host Amelia Dalton speaks with David Jedynak of Curtiss-Wright about the past, present, and future of VITA standards.

The CHAMP-XD4 features dual Intel Xeon D-2700 processors, and is for demanding intelligence, surveillance and reconnaissonce (ISR) system architectures.

Much of the innovation in high-performance embedded computing starts with microprocessors.

For defense applications, responsiveness, accuracy, and precision have never been more critical to mission success.

For critical and intelligent deployed embedded modules, air-flow-through (AFT) cooling describes an approach that brings the coolant much closer to heat-generating electronics than standard conduction-cooled approaches.

Currently, there are two options for VITA 46.30 connectors: the TE Connectivity RT3 and Amphenol R-VPX EVO2 connectors, both of which meet the ANSI/VITA 46.30 standard intended for 100G (4-lanes @ 25 Gbaud) systems, and potentially beyond.

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

A new partnership between Northrop Grumman and Curtiss Wright targets the virtualization of obsolete military avionics systems.