As aircraft embedded systems grow in complexity and the aviation industry embraces hybrid electric power, new methods of cooling are emerging to resolve thermal management and overheating challenges.

Ivan Straznicky explains how liquid cooling is becoming more efficient and affordable to give systems designers a leg-up in the battle against electronics heat.

VITA 48.8 represents an approach for cooling embedded systems using an air flow through (AFT) technique that significantly reduces the SWaP-C of deployed electronics devices.

Helen Haxell looks at how ANSI/VITA 48.8, could soon be applied to the next generation of aircraft, including Future Vertical Lift (FVL).

The emergence of smaller components with more processing capability while operating at much lower power has had the counterintuitive effect of increasing thermal density, with designers expected to pack even more functionality into ever-smaller spaces.

The rise of the Internet of Things (IoT) and Industrial IoT (IIoT) is not the only reason for increased demand for safety- and security-related solutions.

William Wong with Electronic Design discusses how cooling is always a challenge in rugged embedded applications, especially military applications.

Kevin Rooney discusses common issues such as waterproofing, operating in extended temperature ranges, readability challenges, and glare with rugged LCD mission displaying.