Parvus DuraCOR 313 mission computer combines next-gen Intel processing with support for Time-Sensitive Networking (TSN) in modular small form factor rugged design

In August 2021, Intel announced the new Intel Xeon W-11000E Series processor ­(formerly known as “Tiger Lake-H”), designed for the embedded market.

Military-display designers continue to face stringent size, weight, power, and cost (SWaP-C) constraints while integrating commercial innovations like HD – and soon 4K – into systems that must work with legacy sensors and interfaces while also complying with a variety of open architectures and standards.

VPX6-1961 SBC features the just announced eight-core Intel Xeon W-11000E Series processor, qualified to deliver significant advances in integrated graphics and accelerated AI/ML processing at extreme temperatures and under demanding shock and vibration co

The Curtiss-Wright AMMS has a high-speed embedded computing suite for high -performance processing, and a modular, scalable open-systems architecture.

Today’s modern warfighters have grown up with smartphones and tablets with intuitive, multitouch projected capacitive (PCAP) touch screens. They rely heavily on these devices in their personal lives and they expect to have access to the same capabilities and conveniences in the field.

VPX6-1961 SBC features the new 8-Core 11th Gen Intel Xeon W (“formerly Tiger Lake-H”) to deliver significant advances in integrated graphics and accelerated AI/ML processing.

Military experts are developing new enabling technologies to help unmanned aircraft, ground vehicles, submarines, and surface vessels swarm and make decisions without human intervention.