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Rugged SOSA-aligned 6U VPX Embedded Computing Module Introduced by Curtiss-Wright

Rugged SOSA-aligned 6U VPX Embedded Computing Module Introduced by Curtiss-Wright

The CHAMP-XD4 features dual Intel Xeon D-2700 processors, and is for demanding intelligence, surveillance and reconnaissonce (ISR) system architectures.

01/02/2024
The Future of High-Performance Embedded Computing

The Future of High-Performance Embedded Computing

Much of the innovation in high-performance embedded computing starts with microprocessors.

10/24/2023
100-Gigabit Ethernet Done Right

100-Gigabit Ethernet Done Right

COTS suppliers have focused on increasing connectivity speeds within and between systems for decades, following the introduction of the VPX standard.

08/31/2023
Military & Aerospace Electronics

Thermal-Management Techniques Take-on the Heat

It's nearly impossible to use power efficiently enough to eliminate waste heat altogether. Enhancing efficiency can help reduce waste heat -- but only to a degree.

10/27/2022
Industry News

Curtiss-Wright Honored to Host Tri-Service Open Architecture Interoperability Demonstration TIM & Expo

Curtiss-Wright has announced that it is serving in the honored role of Distinguished Host for the Tri-Service Open Architecture Interoperability Demonstration (TSOA-ID) TIM & Expo being held March 15 at the Solomons Inn Resort, Marina, MD.

03/15/2022
military and aerospace electronics

Embedded Computing Enclosures go Standard, and go Small

Industry standards and guidelines such as MOSA, SOSA, CMOSS, SAVE, and FACE are driving the latest developments in enclosures, chassis, and backplane databuses, as small for factors are ready to take center stage.

02/24/2022
Curtiss-Wright Defense Solutions Engineers Honored as Curtiss-Wright Technical Fellows

Curtiss-Wright Defense Solutions Engineers Honored as Curtiss-Wright Technical Fellows

Three members of Curtiss-Wright Defense Solutions engineering team recognized for excellence under Curtiss-Wright Corporation Technical Fellow Program

02/07/2022
Military & Aerospace Electronics

Is Thermal Management up to the High-performance Computing Challenge?

Embedded computing designers squeeze the most out of conduction, convection, and liquid cooling, and look to the future of disaggregated architectures and 3D printing.

10/29/2021